SILICON LABS

Silicon Labs introduce FGM230S Sub Gig Proprietary 6.5mm X 6.5mm SiP Module

The FGM230S is a system-in-package (SiP) module for Proprietary wireless connectivity built for the performance, security, and energy demands of Proprietary applications.

FGM230S delivers robust RF performance, long-range, industry leading security features, low-current consumption, a rich set of MCU peripherals, and ample memory, all in a 6.5 x 6.5 mm package. The FGM230S is a complete solution supported by powerful and fully upgradeable software, advanced development and debugging tools, and documentation that will simplify and minimize the development cycle, certification process, and deployment of your endproduct, helping to accelerate its time-to-market significantly. 

The FGM230S is targeted for a broad range of applications, including: •Metering •Home and Building Automation and Security •Industrial Automation •Street Lighting

 

KEY FEATURES 

• Proprietary uncertified connectivity
RF pin for external antenna
+14 dBm TX power
-109.8 dBm RX sensitivity @100 kbps 
32-bit ARM Cortex-M33 core at 39 MHz
512/64 kB of Flash/RAM memory 
Advanced security features 
Rich set of MCU peripherals 
Integrated DC-DC converter 
34 GPIO pins 
-40 to 85 °C 
6.5 mm x 6.5 mm