Author name: data

We are thrilled to share the news that, at WINBOND’s annual conference, Data JCE Electronics (the official representative of WINBOND) received recognition for its substantial activities spanning the years 2020-2023. WINBOND acknowledged Data Jce Electronics as the outstanding distributor, achieving the best revenue growth performance for the past three consecutive years. Based in Taiwan, WINBOND […]

חדש  !!! מחלקת מכאניקה.נשמח להעניק קשת רחבה של פתרונות בתחום המכאניקה אנו יודעים להפוך את הרעיונות שלכם למוצר מנצח . ליווי הנדסי מקצה לקצה תכנון וייצור חלקים מכניים בסין במפעלים מוסמכים כולל תקינה עם נסיון עתיר שנים מוכח לפתרון המלא קרא כאן להורדה איתמר פדרמן מנהל הפעילות ישמח לקבל את פניתיכםitamarf@data-jce.com050-7800494

DEGSON circular connector is coming.  In accordance with IEC 61076 standard, the brand new M12 plastic shell series, unlock more connection ways, to provide you with more supporting solutions.    Download & Read all about it here  

Hear more about the BB5 family from Silicon Labs The EFM8BB5 family is built on the proven C8051 core that has been a staple of the Silicon Labs 8-bit MCU offering since its inception. The BB5 family consists of three variants: the BB50, BB51, and BB52. Each variant has a solution to meet most application

Official distributor www.Data-JCE.COM  September 2023  New 32GB, 64GB, and 128GB eMMC Solutions  The News: Alliance Memory introduces new 32GB, 64GB, and 128GB industrial grade embedded multi-media card (eMMC) solutions. For solid-state storage in consumer, industrial, and networking applications, the devices integrate high-reliability TLC NAND flash memory with an eMMC controller and flash transition layer (FTL) management

We had great two days during New Tech 2023. We had the opportunity to meet many friends from different companies and present our leading solutions.We presented our wide range of Memory , IOT , Military and Aerospace , Power , Interconnect, Timing and Optical solutions.Many Thanks to our partners from Winbond , and Silicon Labs

Winbond has a long track record of semiconductor production at its own 12” wafer fabrication in Taiwan. The company continues to invest in new process technologies and equipment at its fab. After completing a migration from 46nm and 38nm to the Winbond 25nm and 25Snm process, Winbond do a further migration to 20nm in 2023. Winbond DRAM

IntroductionThe average household has more IoT devices than ever before, and wireless device manufacturers are tasked with keeping up with demand and setting the rules of engagement for emerging technologies. Their efforts in areas like battery life and device security will influence technology adoption today and long into the future. With rapid technological advancement, the variety of connected devices and application

Data-JCE have been participate on Winbond annual marketing conference during March , in Taiwan . the successful partnership that been official sign on 2019 between both companies have brought number 1 records for Israeli territory ever for Winbond Activity both on Dram and Flash components. Winbond is the biggest manufacturer of Nor flash world wide